Optical module implementing with optical source, optical modulator, and wavelength detector, and a method to assemble the same

ABSTRACT

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

TECHNICAL FIELD

The present invention relates to an optical module that installs an optical source including a semiconductor laser diode (LD), an optical modulator, and a wavelength detector; and the invention further relates to a method of assembling the optical module.

BACKGROUND ART

An optical module that installs a wavelength tunable semiconductor laser diode (t-LD) and an optical modulator that modulates CW light emitted from the t-LD has been well known in the field. A Japanese patent application laid open No. 2009-146992 has disclosed such an optical module. The CW light output from the t-LD optically couples with the optical modulator via optical fibers. However, an optical fiber when it is bent with a large curvature causes a bent loss. Accordingly, when an optical transceiver with limited sizes in a housing thereof installs a t-LD and an optical modulator, techniques to compensate the bent loss caused in inner fibers is needed.

SUMMARY OF INVENTION

One aspect of the present application relates to a process of assembling an optical module that installs a laser unit, a modulator unit, and a detector unit within a housing. The laser unit includes a semiconductor laser diode (LD) having a front facet that outputs a first continuous wave (CW) beam and a rear face that outputs a second CW beam. The modulator unit modulates a first CW beam. The detector unit determines a wavelength of the second CW beam. The housing includes a first output port and a second output port. The process of the present application comprises steps of: (1) installing a first thermo-electric cooler (TEC), a second TEC, and a third TEC within the housing; (2) mounting the laser unit on the first TEC, the modulator unit on the second TEC, and the detector unit on the third TEC, respectively; (3) optically coupling one of the first CW beam with a first output port of the housing through the modulator unit and the second CW beam with a second output port of the housing through the detector unit; and (4) optically coupling another of the first CW beam with the first output port of the housing through the modulator unit and the second CW beam with the second output port of the housing through the detector unit. One of features of the process of the present application is that the step of coupling the first CW beam with the first output port includes steps of: (3-1) optically coupling the laser unit with the optical modulator through the input unit, and (3-2) optically coupling the modulator unit with the first output port through the output unit. Another feature of the present method is that the step of coupling the second CW beam with the second output port includes steps of: (4-1) optically coupling the detector unit with the laser unit and (4-2) optically coupling the detector unit with the second output port.

Another aspect of the present application relates to an optical module that comprises a wavelength tunable laser diode (t-LD) having a first facet and a second facet, an optical modulator, a wavelength detector, a housing, and first and second output ports. The t-LD outputs a first CW beam from the first facet and a second CW beam from the second facet. The optical modulator, which is primarily made of semiconductor materials, generates a first output beam by modulating the first CW beam. The wavelength detector, which may determine an oscillation wavelength of the t-LD, splits the second CW beam into a monitored beam and a second output beam. The housing, which includes a front wall, a rear wall, and two side walls connecting the front wall to the rear wall, encloses the t-LD, the optical modulator, and the wavelength detector in a space partitioned by the front wall, the rear wall, and the side walls. The first output port and the second output port, which are provided in the front wall, output the first output beam and the second output beam, respectively. One feature of the optical modulator of the present application is that the wavelength detector and the t-LD are arranged on an optical axis of the second output port along one of the side walls, but, the optical modulator is arranged on an optical axis of the first output port along another of the side walls. The optical modulator of the present application further provides a feature that the optical modulator has an input port, an output port, and a signal pad, where the input port is provided in a side of the optical modulator facing the one of the side walls of the housing, the output port is provided in a side of the optical modulator facing the front wall of the housing, and the signal pad is provided in a side of the optical modulator facing the rear wall, where the signal pad provides a signal containing high frequency components.

Still another aspect of the present application relates to an optical module. The optical module of the present aspect comprises an optical source, an optical modulator, and an input unit. The optical source, which is mounted on a first TEC as interposing a first carrier therebetween, generates a continuous wave (CW) beam, where the first carrier provides marks thereon. The optical modulator, which is mounted on a second TEC independent of the first TEC as interposing a base therebetween, modulates the CW beam. The input unit, which couples the CW beam with the optical modulator, is mounted on the base as interposing a second carrier therebetween, where the second carrier provides marks thereon. One feature of the present optical module is that the marks on the second carrier of the input unit are aligned with the marks on the first carrier of the optical source.

Still another aspect of the present application relates to an optical module. The optical module of the present aspect includes an optical source, an optical component, a housing, and a beam shifter. The optical source generates a beam accompanied with an optical axis. The optical component, which is optically coupled with the optical source, has another optical axis offset from the optical axis of the beam. The housing having a bottom disposes the optical source and the optical component on the bottom thereof. The beam shifter is interposed between the optical source and the optical component. A feature of the optical module of the present aspect is that the beam shifter aligns the optical axis of the beam measured from the bottom of the housing with the other optical axis of the optical component measured from the bottom of the housing.

Still another aspect of the present application relates to a method of assembling an optical module that provides an optical source, beam shifter, an optical component, a concentrating lens, and a housing. The optical source generates an optical beam. The optical component is optically coupled with the optical beam. The concentrating lens concentrates the optical beam on the optical component. The housing, which has a bottom, encloses the optical source, the concentrating lens, and the optical component therein. The method comprises steps of: (1) disposing the beam shifter between the optical source and the concentrating, where the beam shifter aligns an optical axis of the optical beam measured from the bottom of the housing to an optical axis of the optical component; and (2) coupling the optical beam output from the beam shifter with the optical component by aligning the concentrating lens.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of an optical module according to an embodiment of the present invention;

FIG. 2 shows an inside of the optical module shown in FIG. 1;

FIG. 3 shows a cross section of a wavelength tunable LD implemented within the optical module shown in FIG. 1;

FIG. 4 is a plan view of a laser unit;

FIG. 5 is a plan view of an optical modulator;

FIG. 6 is a plan view of a detector unit;

FIG. 7 is a plan view of a modulator unit;

FIG. 8 is an exploded view of the modulator unit;

FIG. 9 is a plan view of the base of the modulator unit, where the base mounts the optical modulator through a carrier;

FIG. 10 is a plan view of a terminator unit mounted on the base shown in FIG. 9;

FIG. 11 is a plan view of a bias unit mounted on the base shown in FIG. 9;

FIG. 12 is a plan view of an input unit to guide the first CW light emitted from the laser unit shown in FIG. 4 into the optical modulator shown in FIG. 2;

FIG. 13A schematically shows a ray tracing of the one lens system, and FIG. 13B shows a ray tracing of the two lens system;

FIG. 14A to FIG. 14F show coupling tolerances of the one lens system (FIGS. 14A and 14B), coupling tolerances of the first lens in the two-lens system (FIGS. 14C and 14D), and coupling tolerances of the second lens in the two-lens system (FIG. 14E and FIG. 14F);

FIG. 15 is a plan view of a joint unit;

FIG. 16 is a plan view of an output unit;

FIG. 17 shows a cross section of the optical module taken along the optical axis extended from the second output port;

FIG. 18 shows a cross section of the optical module taken along the optical axis extended from the first output port;

FIG. 19 is a plan view of the arrangement along the wiring substrates, the laser unit, and the detector unit;

FIG. 20 is a plan view of the arrangement around the laser unit including two wiring substrates;

FIG. 21 is a perspective view of the laser unit and two wiring substrates;

FIG. 22 shows a flow chart of a process to assembly the optical module shown in FIG. 1;

FIG. 23 shows a process to assemble the t-LD on the LD carrier;

FIG. 24 shows a process to assemble the optical modulator, the input unit, the joint unit, two bias units, two terminator units, and two PD sub-mount on the base of the modulator unit;

FIG. 25 shows a process to align the joint unit and the input unit on the base of the modulator unit with the laser unit;

FIG. 26 shows a process to assemble the output unit with the optical modulator;

FIG. 27 is a plan view showing a process to install the TECs, the wiring substrates, and the VOA substrate into the housing of the optical modulator;

FIG. 28 is a plan view showing a process to mount the LD carrier and the lens carriers on the first TEC, the base of the modulator unit, which mounts the input unit, the joint unit, the output unit, the bias units, the terminator units, and the PD sub-mounts thereon;

FIG. 29 shows a process to align the detector unit with the laser unit;

FIG. 30 shows a process to align the first collimating lens in a position at which the output beam of the collimating lens becomes a collimated beam;

FIG. 31 shows a process to shift the optical axis of the laser unit so as to be aligned with the optical axis of the optical modulator;

FIG. 32 shows a process to align the beam splitter in the input unit; and

FIG. 33 shows a process to align the first lens and the second lens with the input port of the optical modulator.

DESCRIPTION OF EMBODIMENTS

Next, some preferred embodiments will be described as referring to drawings. In the description of the drawings, numerals or symbols same with or similar to each other will refer to elements similar to or same with each other without overlapping explanations.

First Embodiment

FIG. 1 is a perspective view of an optical module according to an embodiment of the present invention and FIG. 2 shows an inside of the optical module shown in FIG. 1. The optical module 1 of the present embodiment may be implemented within an optical transceiver applicable to the optical coherent system. The optical coherent system utilizes the phase of light, in addition to the magnitude thereof, as one bit information. When the optical signals corresponding to the phase components of 0° and 90°, that is, when the coherent system multiplexes the optical signals each having the phase components of 0° and 90°, the system may transmit two-bits information at the same time.

The optical module 1 includes a laser unit 100, a modulator unit 200, and a detector unit 300 within a housing partitioned by a front wall 2A, a rear wall 2B, and two side walls, 2C and 2D, connecting the front wall 2A to the rear wall 2B. The laser unit 100 optically couples with both the modulator unit 200 and the detector unit 300. Specifically, the optical module 1 outputs a modulation signal D1 from the first output port 3 a, where the modulation signal D1 is obtained by modulating first continuous wave (CW) beam L1 output from a wavelength tunable laser diode (t-LD) 10 implemented within the laser unit 100 by an optical modulator 20 installed in the modulator unit 200. Concurrently with the first modulation signal D1, the optical module 1 may output another optical signal D2 from the second output port 3 b, where the optical signal D2 is originated from the other CW beam L2 output from the t-LD 10 to the detector unit 300 and divided in the detector unit 300. The first CW beam L1, which is output from the t-LD 10 substantially in parallel to the optical axes of the output ports, 3 a and 3 b, toward the rear wall 3B, enters the optical modulator 20 along the rear wall 2B bent by substantially 90°. The other CW beam L2, which is emitted from the t-LD 10 substantially in parallel to the optical axes of the output ports, 3 a and 3 b, toward the front wall 2A.

The optical module 1 of the present embodiment has a feature that the optical module 1 mounts the laser unit 100, the modulator unit 200, and the detector unit 300 on respective thermo-electric coolers (TECs) implemented in the housing independently. Moreover, the optical module 1 provides radio-frequency (RF) terminals 4 only in the rear wall 2B, and DC terminals, 5 a and 5 b, in the respective side walls, 2C and 2D. Because the RF terminals 4 and the DC terminals, 5 a and 5 b, are independent in respective walls; the electrical control of the optical module 1 may be simplified and stabilized.

The modulator unit 200, as described above, modulates the first CW beam L1 in the phase thereof and outputs the phase-modulated optical signal. That is, the optical modulator 20 implemented within the modulator unit 200 divides the first CW beam L1 into four beams, and modulates these four beams independently by four modulation signals provided through the RF terminals 4, where two of four modulated signals output from the optical modulator 20 have phase components different by 90° from the rest of two modulated signals. The former two modulated signals are often called as I-components (In-phase component), while, the latter two modulated signals are called as Q-components (Quadrature component). One of I-components and one of Q-components are further modulated by the polarization thereof. That is, one of the I-components and one of the Q-components are rotated in the polarization thereof and multiplexed with the other of the I-components and the other of the Q-components. The optical module 1 may output the modulated signal D1, which multiplexes four optical signals, from the first output port 3 a as the phase-polarization modulated signals, which is often called as the dual polarization quadrature phase shift keying (DP-QPSK). The optical module 1 may further output another optical signal D2, which is obtained by dividing the second CW beam L2 output from the t-LD 10 by the detector unit 300. One of the divided CW beam is used for determining the wavelength of the CW beam L2, and the rest is output from the second output port 3 b as the output CW beam D2.

Next, details of the respective units, 100 to 300, will be described.

Tunable Laser Diode (t-LD)

FIG. 3 shows a cross section of a wavelength tunable LD implemented within the optical module shown in FIG. 1. The t-LD 10 includes two semiconductor optical amplifiers SOAs, 10 a and 10 d, and a sampled grating distributed feedback (SG-DFB) 10 b and a sampled grating distributed Bragg reflector (SG-DBR) 10 c, where the latter two regions, 10 b and 10 c, may determine the emission wavelength of the t-LD 10. These four regions are arranged along an optical axis of the t-LD 10. The present t-LD 10 provides one facet 10A in one of the SOA 10 a to transmit the first CW beam L1 and another facet 10B in the other SOA 10 d to transmit the second CW beam L2.

The SG-DFB 10 b includes a sampled grating (SG) 18, where the sampled grating 18 is featured by regions each including a plurality of gratings and separated by spaces without any gratings. The gratings in respective regions have a constant pitch and the spaces have a constant length along the optical axis. When the spaces have various lengths, the sampled grating may be called as the chirped-sampled grating. The SG-DFBs 10 b includes gain regions, 12 a to 12 c, including the SG 18, and modulation regions, 13 a and 13 b, also including the SG 18. The gain regions, 12 a to 12 c, may be provided with carriers through electrodes 14 a on a top surface of the device. On the other hand, the modulation regions, 13 a and 13 b, provides heaters, 15 a and 15 b, in the top surface thereof. A combination of the gain regions, 12 a to 12 c, and the modulation regions, 13 a and 13 b, the SG-DFB 10 b may show the optical gain spectrum having a plurality of gain peaks reflecting the SG 18 in the SG-DFB 10 b. Providing power to the heaters, 15 a and 15 b, that is, heating up or cooling down temperatures of the waveguide layers 19 b beneath the heaters, 15 a and 15 b, optical characteristics of the modulation regions, 13 a and 13 b, may be modified, that is, wavelengths of the gain peaks inherently attributed to the SG-DFB 10 b may be changed.

The CSG-DBR 10 c of the present embodiment provides three sections, 16 a to 16 c, each having heaters, 17 a to 17 c, operable independently. Because the CSG-DBR 10 c does not includes any gain regions, the CSG-DBR 10 c inherently show reflection spectrum having a plurality of reflection peaks. Powering the heaters, 17 a to 17 c, to modify temperatures of the waveguide 19 b beneath the heaters, 17 a to 17 c, the reflection peaks in the spectrum of the CSG-DBR 10 c may be changed in the wavelengths and intervals thereof. At least one of the sections, 16 a to 16 c, has physical features distinguishable from those of the rest sections. In the present t-LD 10, the section, 16 a to 16 c, provides optical lengths different from others. That is, the spaces without diffraction gratings have respective optical lengths different from others, which are called as the chirped-sampled diffraction Bragg reflector (CSG-DBR). The reason why the t-LD 10 of the present embodiment provides the CSG-DBR, not the SG-DBR, is that a range where the reflection peaks appears may be widened by modifying the temperatures of the waveguides in respective regions independently. Adjusting the power supplied to the heaters, 15 a and 15 b, in the SG-DFB 10 b and the heaters, 17 a to 17 c, in the CSG-DBR 10 c, one of the gain peaks attributed to the SG-DFB 10 b matches with one of the reflection peaks attributed to the CSG-DBR 10 c. Then, the SG-DFB 10 b and the CSG-DBR 10 c may form a cavity for the t-LD 10 and the t-LD may oscillate at the matched wavelength. This matched wavelength is optional by adjusting the power supplied to the heaters, 15 a and 15 b, and 17 a to 17 c.

The first and second SOAs, 10 a and 10 d, may amplify an optical beam generated by the gain regions, 12 a to 12 c, and determined in the wavelength thereof by the optical coupling of the SG-DFB 10 b with the CSG-DBR 10 c. The optical gain of the SOAs, 10 a and 10 d, may be variable by injecting carries into the active layer 19 a through the electrode 14 d in the first SOA 10 a, and carries into the other active layer 19 a through the electrode 14 e in the second OSA 10 d. Thus, the amplitude of the first and second CW beam, L1 and L2, are variable. The waveguide 19 b in the modulation regions, 13 a and 13 b, in the SG-DFB 10 b and that in the CSG-DBR 10 c may be made of semiconductor material with energy band gap greater than that of the active layer 10 a in the SOAs, 10 a and 10 b, and the gain regions, 12 a to 12 c, in the SG-DFB 10 b to make the waveguide 19 b substantially in transparent for the optical beam subject to the t-LD 10.

FIG. 4 is a plan view of a laser unit 100. The laser unit 100 includes a first thermo-electric cooler (TEC) 11 that mounts two collimating lenses, 110 a and 110 b, and the t-LD 10 through a base 100 a. Specifically, the first TEC 11, which includes a top plate 11 a, a bottom plate 11 b, and a plurality of thermo-electric converting elements, typically Peltier elements, may cause a temperature difference between two plates, 11 a and 11 b, depending on a magnitude and a direction of a current flowing in the Peltier elements. The bottom plate 11 b has a size wider than that of the top plate 11 a. That is, the bottom plate 11 b has a portion exposed from the top plate 11 a, and two posts, 11 c and 11 d, to supply the current to the Peltier elements on the bottom plate 11 b. The temperature of the top plate 11 a may be sensed by a thermistor 11 f mounted on the top plate 11 a.

The base 100 a, which has a size substantially same with that of the top plate 11 a of the first TEC 11, may be made of aluminum nitride (AlN) and mounts two collimating lenses, 110 a and 110 b, through respective lens carriers, 110A and 110B, and the t-LD 10 and the thermistor 11 f through an LD carrier 100A. These carriers, 100A, 110A and 110B, may be also made of AlN but the LD carrier 100A has a thickness greater than respective thicknesses of the lens carriers, 110A and 110B, to match the level of the optical axis of the t-LD 10 with those of the collimating lenses, 110 a and 110 b. The LD carrier 100A provides interconnections 100 b thereon to provide biases to the t-LD 10. The t-LD 10 is necessary to be supplied with a bias to inject carriers into the gain regions, 12 a to 12 c, power to the heaters, 15 a and 15 b, in the SG-DFB 10 b, power to the heaters, 17 a to 17 c, in the CSG-DBR 10 c, biases to the SOAs, 10 a to 10 d, to secure the optical gains therein, and some grounds. The LD carrier 100A requires the interconnections 100 b to supply these biases and power to the t-LD 10.

Optical Modulator

FIG. 5 is a plan view of an optical modulator. The optical modulator 20 may include a plurality of modulation elements, for example four (4) Mach-Zehnder (MZ) elements, 51 to 54, are integrated on a semiconductor substrate made of indium phosphide (InP) in the present embodiment. The optical modulator 20 of the embodiment includes three 1:2 couplers, 50 a to 50 c, to distribute the CW beam L1 entering from the input port 24 into four MZ elements, 51 to 54. Specifically, the CW beam L1 entering the input port 24 is bent substantially in a right angle along the waveguide and evenly divided into two partial beams by the first 1:2 coupler 50 a. The respective partial beams are further evenly divided by the second and third 1:2 couplers, 50 b and 50 c, into four partial beams, and the four partial beams enter the MZ elements, 51 to 54, respectively. Two 2:2 couplers, 50 d and 50 e, are provided in downstream of the MZ elements, 51 to 54, to multiplex the modulated beam.

The explanation below concentrates on the first MZ element 51. But, other MZ elements, 52 to 54, may operate in the same manner with the first MZ element 51.

The partial CW beam divided by the second 1:2 coupler 50 b and entering the MZ element 51 is further evenly divided into two portions by the 1:2 coupler 51 a each heading the arm waveguides, 51 h and 51 i. In the arm waveguides, 51 h and 51 i, in particular, within the functional region 51M providing the modulating electrodes, 51 e and 51 f, and the ground electrode 51 g, the divided beam are modulated in the phases thereof. After passing the functional region 51M, the divided beam in the phases thereof are further modulated, or offset in the offset electrodes, 51 j and 51 k. Finally, the divided beams are combined by the 1:2 coupler 51 b to be output from the MZ element 51.

The operation of the functional region 51M and the offset electrodes, 51 j and 51 k, will be described. The offset electrodes, 51 j and 51 k are statically pre-biased such that the optical beams propagating in the respective arm waveguides, 51 h and 51 j, have a phase difference of pi (π). For instance, the optical beam propagating in the one arm waveguide 51 h is delayed by pi (π) with respect to the beam propagating in the other arm waveguide 51 j. Then, one of the modulating electrodes 51 e for the arm waveguide 51 h is supplied with a bias to cause the phase delay of pi (π) but the other modulation electrode 51 f is supplied with a bias causing no phase delay. The beam propagating in the arm waveguide 51 h is caused by the phase delay of 2π by the modulation electrode 51 e and the offset electrode 51 j; but, the beam propagating in the other arm waveguide 51 i shows no phase delay caused by the modulation electrode 51 f and the offset electrode 51 k. Combining two optical beams each propagating in the arm waveguides, 51 h and 51 i; the combined beam shows a phase delay of zero. The phase delay of 2π is equal to the phase delay of 0.

On the other hand, when the modulation electrode 51 e is supplied with a bias causing no phase delay for the beam propagating in the arm waveguide 51 h thereunder but the other modulation electrode 51 f is supplied with a bias causing the phase delay of pi (π); the beam combined by the 2:1 coupler 51 b has the phase delay of pi (π) because the former beam propagating in the arm waveguide 51 h is delayed in the phase thereof by the static bias of the offset electrode 51 j. Thus, the optical output of the MZ element 51 becomes CW beam whose phase is modulated between 0 and pi (π) but the amplitude thereof is kept substantially constant. The amplitude of the optical output strictly changes at the transitions of the phase. Referring to FIG. 5, the modulation signals provided to the modulation electrodes, 51 e to 54 e and 51 f to 54 f, are supplied from the pads, 41 to 44, which are formed in one edge of the optical modulator 20, through interconnections which are terminated at pads, 45 a and 45 b, provided in respective sides of the optical modulator 20 in downstream of the modulation electrodes, 51 e to 54 e and 51 f to 54 f. Also, the static biases supplied to the offset electrodes, 51 j to 54 j and 51 k to 54 k, are provided from the pads, 46 a and 46 b, formed in respective sides of the optical modulator 20.

The quadrature electrodes, 51 c to 54 e, in the function thereof will be described. The optical modulator 20 of the embodiment includes four (4) MZ elements, 51 to 54. The two quadrature electrodes, 52 c and 54 c, are supplied with static biases such that the phases of the beams propagating thereunder cause a phase difference of π/2 with respect to the other beams propagating in the waveguides under the quadrature electrodes, 51 c and 53 c, which form the pairs with the respective quadrature waveguides, 52 c and 54 c. Accordingly, even after combining two optical beams each propagating in the waveguides under the quadrature electrodes, 51 c and 52 c, 53 c and 54 c, the optical beams may be independently extracted. The optical beams output from the MZ elements, 51M and 52M, and those from the MZ elements, 53M and 54M, may be multiplexed with respect to the phases, one of the optical beams, subject to the MZ elements, 51M and 53M, are called as the I-component (In-phase), and the other is called as the Q-component (Quadrature). The optical modulator 20 may output two optical signals, M2 b and M2 c, each modulated in the phase, from respective output ports, 22 a and 22 b, and other two optical signals, M2 a and M2 d, from respective monitor ports, 25 a and 25 b.

In the optical modulator 20 thus described, the modulation of the optical beams may be carried out by varying refractive index of the waveguide made of semiconductor materials in the functional regions, 51M to 54M. A semiconductor material shows a large electro-optical coupling efficiency, which is called as the Kerr effect, for the optical beam whose wavelength is slightly longer than a bandgap wavelength of the semiconductor material, which corresponds to the bandgap energy of the material. A larger Kerr efficiency means that a modulation signal with a smaller amplitude may cause the substantial modulation in optical characteristics of the semiconductor material. However, the bandgap wavelength of the semiconductor material has substantial temperature dependence, which results in a large variation of the modulation characteristic of the optical modulator 20. The present optical module 1 mounts the optical modulator 20 on the second TEC 20 to compensate the temperature dependence of the modulation performance thereof.

Wavelength Detector

FIG. 6 is a plan view of a detector unit 300. The detector unit 300 includes a first beam splitter (BS) 32 a, an etalon filter 33, a first monitor photodiode (m-PD) 34 a, a second BS 32 b, and a second m-PD 34 b, where these components are mounted on a third TEC 31 through a carrier 300 a made of AlN, where the carrier 300 a will be referred as the third carrier. Two m-PDs, 34 a and 34 b, are mounted on the carrier 300 a through respective PD sub-mounts, 34A and 34B. The third TEC 31, similar to those first and second TEC, 11 and 21, provides a top plate 31 a and a bottom plate 31 b. The bottom plate 31 b is wider than the top plate 31 a and the carrier 300 a, and mounts two posts, 31 c and 31 d, in an area exposed from the top plate 31 a and the carrier 300 a in order to supply a current to Peltier elements mounted on the bottom plate 31 b. The TEC 31 may compensate temperature characteristics of the etalon filter 33.

The etalon filter 33, which may be a parallel piped plate, shows a specific transmittance, in particular, periodical transmittance exhibiting strong wavelength dependence determined by a thickness of the parallel piped plate and refractive index of a material constituting the parallel piped plate.

The first BS 32 a and the second BS 32 b of the present detector unit 300 have a type of slab made of material substantially transparent to the second CW beam L2, typically, two BSs, 32 a and 32 b, may be a slab made of silica glass. The first BS 32 a splits the second CW beam L2, which is output from the t-LD 10 and converted into a collimated beam by the second collimating lens 110 b, into two beams. One of the split beam advances to the etalon filter 33, while, the rest of the split beam goes to the second BS 32 b. The present embodiment of the detector unit 300 sets a ratio of two beams to be 5:95, that is, about 5% of the second CW beam LS enters the etalon filter 33, and the rest 95% goes to the second BS 32 b. The former split beam transmitting through the etalon filter 33 enters the second m-PD 34 b. The other split beam, which is bent by a right angle at the first BS 32 a, goes to the second BS 32 b and is split thereby into two beams. One of the split beams passing through the second BS 32 b enters the first m-PD 34 a, and the other beam, which is reflected in a right angle by the second BS 32 b, is output from the optical module 1 as the second output D2. The split ratio of the second BS 32 b is set to be also 5:95. Accordingly, the output beam D2 has the magnitude of about 90% of that of the second CW beam L2 entering the detector unit 300. The residual of the second CW beam L2 enters the first and second m-PDs, 34 a and 34 b, to determine the wavelength of the second CW beam L2.

The detector unit 300 may evaluate the transmittance of the etalon filter 33 by a ratio of the output of the second m-PD 34 b to the output of the first m-PD 34 a. Practical transmittance of the etalon filter 33 may be specified by the specification thereof, the ratio of the two outputs may determine the wavelength of the second CW beam L2 by comparing this ratio with the specification of the etalon filter 33. Moreover, controlling the biases supplied to the t-LD 10 and the temperature thereof by the first TEC 11 such that the ratio of the outputs of the two m-PDs, 32 a and 32 b, comes closer to the transmittance of the etalon filter 33 at a target wavelength, the emission wavelength of the t-LD 10 may coincide with the target wavelength. An etalon filter has been known as an optical device whose transmittance periodically varies against wavelengths. Accordingly, when the period of the periodic transmittance of the etalon filter matches with a span between nearest grids defined in the wavelength division multiplexing (WDM) system, which is 100, 50, and/or 25 GHz in the specification of the WDM system, the optical module 1 of the embodiment may easily set the emission wavelength to be equal to one of the grid wavelengths of the WDM system.

The temperature dependence of the periodic transmittance of the etalon filter 33 is far smaller than that of the emission wavelength of the t-LD 10. However, the present optical module 1 provides the laser unit 100 and the detector unit 300 each independently providing TECs, 11 and 31, because a temperature variation in a TEC in the laser unit slightly affects the transmittance of an etalon filter when the laser unit and the detector unit provide a common TEC.

Also, the output of the first m-PD 34 a, which directly senses a portion of the second CW beam L2, namely, a portion of the optical beam not passing through the etalon filter 33, may be served for controlling the output power of the t-LD 10. That is, by feeding the output of the first m-PD 34 a back to the bias, particularly, the injection current into the gain regions, 12 a to 12 c, in the SG-DFB 10 b, the optical module 1 may control the magnitude of the second CW beam L2 in a constant level, which may be called as the automatic power control (APC) of a t-LD 10.

Modulator Unit

FIG. 7 is a plan view of a modulator unit 200, and FIG. 8 is an exploded view of the modulator unit 200. The modulator unit 200 includes an input unit 210 and a joint unit 220 each couple the first CW beam L1 output from the laser unit 100 with the optical modulator 20. The input unit 210 includes a BS 61 and a lens system 63 that are mounted on the base 200 a through another carrier 210 a, which will be referred as the second carrier. The joint unit 220 includes a beam shifter 81 and an optical isolator 82 on the base 200 a through another carrier 220 a, which will be referred as the third carrier. The first CW beam L1 output from the laser unit 100 enters the input port 24 of the optical modulator 20 after the beam shifter 81 compensates a level difference between the optical axis of the laser unit 100 and the input port 24 of the optical modulator 20, and the optical isolator 82 cuts the backward beam from the optical modulator 20 to the t-LD 10. The BS 61 may be a type of prism mirror shown in FIG. 8 or parallel plate shown in FIG. 7 each made of material substantially transparent for the first CW beam L1. The BS 61 reflects a part of the first CW beam L1, about 95% thereof, and transmits a rest 5% toward the m-PD 62 a which is mounted on the base 200 a through a PD sub-mount 62A.

Base

FIG. 9 is a plan view of the base 200 a, which may be made of AlN and has an L-shape with a cut 200 c in a corner between a horizontal bar and a vertical bar of the L-character. Referring to FIG. 8, the second TEC 21, similar to the aforementioned TECs, 11 and 31, has a rectangular plane shape with posts, 21 c and 21 d, in a corner thereof facing the rear wall 2B and the side wall 2C of the housing 2. The Peltier elements mounted on the bottom plate 21 b of the second TEC 21 may be supplied with a current through the posts, 21 c and 21 d.

The base 200 a, which has a plane shape of an L-character, is mounted on the second TEC 21 in an area closer to a corner of the L-character. The base 200 a has an area greater than the area of the top plate 21 a of the second TEC 21. That is, even when the base 200 a is mounted on the second TEC 21, periphery portions on the base 200 a are not overlapped with the top plate 21 a of the second TEC 21. The base 200 a provides a cut 200 c in the corner of the L-character, through which two posts, 21 c and 21 d, of the second TEC 21 are exposed. The tops of the posts, 21 c and 21 d, project from the base 200 a, that is, the top levels of the posts, 21 c and 21 d, are set higher than the primary surface of the base 200 a, which enhances the productivity, or the wiring to the top of the posts, 21 c and 21 d.

Two areas, 200B and 200C, in the base 200 a, which correspond to end portions of respective bars of the L-shape, are not overlapped with the top plate 21 a of the second TEC 21. That is, the two areas, 200B and 200C, protrude from respective edges of the top plate 21 a of the second TEC 21. The latter area 200C mounts the output unit 230, while, the former area 200B mounts the input unit 210 and the joint unit 220. The joint unit 220 is set forward of the input unit 210.

The base 200 a has a size substantially equal to that of the optical modulator 20. That is, base 200 a has a lateral width substantially equal to a lateral width of the optical modulator 20 but narrower than a lateral width of the top plate 21 a of the second TEC 21. Mounting the base 200 a on the top plate 21 a of the second TEC 21 and the output unit 230 on the base 200 a, the front edge of the second TEC 21 locates on a position of the second lens 73 b in the output unit 230, where the second lens 73 b is set apart from the optical modulator 20 compared with the first lens 73 a. Two m-PDs, 64 a and 64 b, are assembled on the base 200 a. The m-PD 64 a is mounted on the side of a sub-mount 64A, and the m-PD 64 b is mounted on the side of a sub-mount 64B. The carrier 20 a is located between m-PDs, 64 a and 64 b and between the sides of the sub-mount 64A and the sub-mount 64B.

The m-PDs, 64 a and 64 b, each have optically sensitive surfaces facing the optical modulator 20 to sense the monitor signals, M2 a and M2 d, output from the monitor ports, 25 a and 25 b, of the optical modulator 20. The m-PDs, 62 a and 62 b, are assembled diagonally on respective sides of the optical modulator 20 corresponding to the positions of the monitor ports, 25 a and 25 b.

Terminator Unit

The terminator units, 84 a and 84 b, are arranged in front sides of the m-PDs, 64 a and 64 b, so as to put the optical modulator 20 therebetween. FIG. 10 is a plan view of one of the terminator units 84 b, and the terminator units 84 a has the same arrangement with those shown in FIG. 10. The terminator unit 84 a includes terminators 85 b, via-holes 85 c, and die-capacitors 85 d on a terminator carrier 84B made of ceramics, typically, alumina (Al₂O₃). The terminator 85 b is a type of thin film resistor formed on the ceramic carrier 84B with resistance of 100Ω. The terminator 85 b may terminate the interconnections 45 b in the optical modulator 20 that transmit modulation signals to the MZ elements, 51M to 54M. The interconnections 45 b shown in FIG. 10 is divided into two groups each having three interconnections and corresponding to two MZ elements, 53M and 54M. Respective center interconnections in the respective groups are wired to the ground pad 85 f and the respective two interconnections are wired to the signal pads 85 e.

The ceramic carrier 84B in a top surface thereof provides interconnections 85 h, while, a whole back surface thereof provides the ground pattern. The ground pad 85 f provides a via-hole 85 c in a center thereof and connected to the ground pattern of the back surface of the ceramic carrier 84B. Interconnections 85 h connected to the respective terminators 85 b are connected to the ground pattern in the back surface of the carrier 84B through respective die-capacitors 85 d and the via-hole 85 c. The interconnecting 85 h common to respective terminators 85 b may be externally biased. Thus, the interconnections 45 b in the optical modulator 20 may be terminated in the AC mode through the terminators 85 b as biased in the DC mode through the interconnections 85 h. The terminator units, 84 a and 84 b, are mounted on the base 200 a through respective carriers, 88A and 88B, provided commonly to the bias units, 86 a and 86 b.

Bias Unit

Two bias units, 86 a and 86 b, are arranged in side by side to the terminator units, 84 a and 84 b, on the common carriers, 88A and 88B, and sandwiches the optical modulator 20 therebetween. FIG. 11 is a plan view showing one of the bias units 86 b, but the other of the bias units 86 a has the same arrangement with those shown in FIG. 11. The optical modulator 20 provides two offset electrodes, 51 j and 51 k, for the X-polarization and the 0° signal, those, 52 j and 52 k, for the X-polarization and 90° signal, those, 53 j and 53 k, for the Y-polarization and 0° signal, and those, 54 j and 54 k, for the Y-polarization and 90° signal. In addition, the optical modulator 20 further provides the quadrature electrodes, 51 c and 52 c, for the X-polarization and those, 53 c and 54 c, for the Y-polarization. Thus, the optical modulator 20 is necessary to be supplied with twelve (12) biases. One of the bias units 86 a provides 6 biases for the X-polarization and the other of the bias units 86 b supplies 6 biases for the Y-polarization.

The bias unit 86 b, as shown in FIG. 11, provides six (6) die-capacitors 87 a and some interconnections 87 b. The six biases are supplied to respective electrodes 45 b in the optical modulator 20 through the interconnections 87 b and the die-capacitors 87 a. Some of the interconnections 87 b are served for grounding the back surfaces of the die-capacitors 87 a.

Input Unit

FIG. 12 is a plan view of the input unit 210. The input unit 210 is mounted on the base 200 a in a portion 200D, which extends from a center portion 200A thereof, through a carrier 210 a made of AlN, which will be referred as the second carrier. That is, the input unit 210 positions on the base 200 a in an end of the vertical bar of the L-character.

The input unit 210 includes, in addition to the carrier 210 a, the input lens system 63 including the first lens 63 a and the second lens 63 b, and a beam splitter (BS) 61. The first CW beam L1 generated in the laser unit 100 is bent by a right angle by the BS 61 to couple the input port 24 of the optical modulator 20 through the input lens system 63.

The input unit 210, as described above, has the two-lens system 63 including the first lens 63 a closer to the optical modulator 20 and the second lens 63 b.

FIG. 13A and FIG. 13B compare the two-lens system (FIG. 13B) with a conventional one-lens system (FIG. 13A). The one-lens system of FIG. 13A and the two-lens system of FIG. 13B both assume the aspheric lenses in which a curvature of the optical beam incoming surface is different from a curvature of the optical beam outgoing surface. Specifically, the one lens system assumes an aspheric lens 63 with an optical beam incoming surface and an optical beam outgoing surface both having spherical surfaces but the curvatures thereof are different from each other, while, the first lens 63 a in the two-lens system shown in FIG. 13B has an arrangement similar to that of the lens 63 in the one-lens system but the second lens 63 b in the two-lens system has a plane surface for the incoming optical beam.

Also, the first lens 63 a in the two-lens system has a thickness different from the lens 63 in the one-lens system. For instance, the lens 63 in FIG. 13A has a thickness W1 of 0.84 mm, but the first lens 63 a and the second lens 63 b in FIG. 13B have thicknesses, W5 and W3, of 0.7 mm and 0.65 mm, respectively. A distance W2 from the beam outgoing surface 63B of the lens 63 to the input port 24 is set to be 0.25 mm or a distance W6 from the beam outgoing surface 63 aB to the input port 24 is also 0.25 mm. The distance W4 from the beam outgoing surface 63 bB of the second lens 63 b to the beam incoming surface 63 aA in FIG. 13B is 0.5 mm. For such lens systems, focal lengths at which the optical coupling efficiency of the CW beams to the input port 24 of the optical modulator become 645 μm.

FIG. 14A to FIG. 14F show alignment tolerances of the lens in the one-lens system and those in the two-lens system, where vertical scales are normalized with respect to the maximum coupling efficiency. FIG. 14A shows a coupling tolerance of the lens 63 in the one-lens system for a deviation from the position at which the maximum coupling efficiency is obtained, along the x-direction, namely perpendicular to the optical axis of the lens. FIG. 14B also shows a coupling tolerance of the lens 63 for the deviation from the position along the optical axis, z-direction. FIG. 14C and FIG. 14D show the tolerances of the coupling efficiency of the first lens 63 a in the two-lens system along the x- and z-directions, and FIGS. 14E and 14F also show the coupling tolerances for the second lens 63 b in the two-lens system along the x- and z-directions.

The lenses, 63, 63 a and 63 b, are fixed at respective positions where the maximum coupling efficiency against the input port 24 is realized by adhesive material typically ultraviolet curable resin. However, solidification of such resin inevitably shrinks through curing, which causes positional deviations of the lenses and degrades the coupling efficiency. Assuming that 20% reduction in the coupling efficiency is acceptable, the lens 63 in the one-lens system and the first lens 63 a in the two-lens system show tolerances along the x-direction of 1.04 and 0.97 μm, respectively. These values are comparable to the shrinkage of the adhesive resin. Accordingly, in the one-lens system, even the lens 63 is aligned in the position at which the maximum coupling efficiency is realized, this maximum coupling efficiency may not secured after the solidification of the adhesive resin, and, no means are left to compensate the degraded coupling efficiency.

On the other hand, the second lens 63 b in the two-lens system shows the alignment tolerances far greater than those of the lens 63 in the one-lens system and the first lens 63 a. In particular, the second lens 63 b shows a large tolerance, about two figures greater than that of the first lens 63 a, along the z-direction. Even when the second lens 63 b deviates from the designed position by 230 μm, the degradation of the coupling efficiency may be set within −0.5 dB. For the tolerance along the x-direction, the second lens 63 b shows a greater tolerance, several times greater than that of the first lens 63 a, and that of the lens 63 in the one-lens system. Accordingly, the two-lens system may securely recover or compensate by the second lens 63 b the coupling efficiency degraded by the shrinkage of the adhesive resin for the first lens 63 a. The adhesive resin for the second lens 63 b also shrinks during the solidification thereof. However, the shrinkage with the second lens 63 b is negligibly smaller compared with the large positional tolerance acceptable for the second lens 63 b.

The carrier 210 a further mounts the m-PD 64 via the PD sub-mount 64A, four interconnections 63 c along a side 210 b facing the joint unit 220 to carry the sensed signals output from the m-PDs, 64 a and 64 b, other two interconnections 63 d along one side 210 c to carry another sensed signal output from the m-PD 62 a. Two of the four interconnections 63 c are for the first m-PD 64 a, and the other two interconnections 63 c are for the second m-PD 64 b mounted in another side of the optical modulator 20. Wiring from the PD sub-mount 64B for the m-PD 64 b in the other side to the PD sub-mount 64A across the optical modulator 20 and further wiring the PD sub-mount 64A to the interconnections 63 c, the sensed signal output from the m-PD 64 b may be carried to the DC terminals 5 a in the side wall 2C. The m-PD 62 a mounted behind the BS 61 may sense the magnitude of the first CW beam L1 entering the optical modulator 20. The BS 61 splits the CW beam L1 by a ratio of 5:95, that is, 5% of the CW beam L1 passes the BS 61, and the rest 95% thereof is reflected by the BS 61 toward the lens system 63. The sensed signal output from the m-PD 62 may be carried on the interconnections 63 d provided along the side 210 c of the carrier 210 a, and wire-bonded to the DC terminals 5 a in the side wall 2C. Feeding the sensed signal of the m-PD 62 a to the bias supplied to the SOA 10 a in the t-LD 10, the first CW beam L1 entering the optical modulator 20 may be kept in the magnitude thereof in constant. The arrangement of the wirings thus described may enable the sensed signals output from the m-PDs, 62 a to 64 b, to be extracted from the DC terminals 5 a in one side wall 2C, even when the m-PD 62 b is placed in the side of the other side wall 2D. Moreover, the interconnections 63 c on the carrier 210 a may not interfere with the optical axis of the first CW beam L1 connecting the laser unit 100 to the BS 61.

Joint Unit

FIG. 15 is a plan view of the joint unit 220. The joint unit 220, similar to the input unit 210, provides a carrier 220 a with a rectangular shape, which will be referred as the third carrier, is mounted on the area 200B of the base 200 a and upstream the input unit 210 closer to the laser unit 100, where the area 200B extends from the center area 200A overlapping with the top plate 21 a of the second TEC 21. The joint unit 220 includes a beam shifter 81, an optical isolator 82, and some interconnections 220 d on the top surface of the carrier 220 a. The interconnections 220 d are wired between the beam shifter 81 and the optical isolator 82.

The beam shifter 81 compensates a vertical discrepancy between the optical axis of the laser unit 100 and the input port 24 of the optical modulator 20. The laser unit 100 and the modulator unit 200 are mounted on respective TECs, 11 and 21, independent to each other. This arrangement often cause an offset between the optical axes of components in the laser unit 100 and those in the modulator unit 200 within a range of allowable tolerances in physical dimensions of those components. Also, even in the modulator unit 200, the coupling unit 220, the input unit 210, and the optical modulator 20 are mounted on the base 200 a via respective carriers, 20 a, 210 a, and 220 a, independent to each other. Accordingly, vertical discrepancies between optical axes of components, namely, the optical isolator 82, the BS 61, the lens system 63, and the optical modulator 20 are often encountered. Adhesive resin to fix the BS 61 and the lens system 63 on the carrier 210 a may adjust the vertical discrepancies of the optical axes. However, when the offset between the optical axes of the laser unit 100 and the input port 24 of the optical modulator 20 becomes large, or exceeds an allowable limit, the resin in thicknesses thereof may not compensate those discrepancies in the optical axes. The lens system 63 is impossible to lower the top level of the carrier 210 a, and thicker adhesive resin for the lens system 63 may degrade the reliability of the fixation.

The beam shifter 81 of the embodiment may compensate the offset between the optical axis of the laser unit 100 and that of the optical modulator 20. The beam shifter 81 is a rectangular block with a beam incoming surface and a beam outgoing surface extending in parallel to each other and made of material transparent to the first CW beam L1. Setting the beam shifter 81 on the carrier 220 a as vertically inclining against the top surface of the carrier 220 a, the optical axis of the first CW beam L1 may translate vertically. The beam shifter 81 is also set on the carrier 220 a inclined horizontally so as to prevent the first CW beam L1 back to the laser unit 100.

The interconnections 220 d are wired between the beam shifter 81 and the optical isolator 82 between one side facing the terminator unit 84 a and the bias unit 86 a to another side facing the side wall 2C so as to avoid the beam shifter 81. Similar to the interconnections 63 c on the input unit 210, the interconnections 220 d on the joint unit 220 may not interfere with the optical axis of the first CW beam L1. The terminator unit 84 a and the bias unit 86 a are electrically connected to the DC terminals 5 a in the side wall 2C through the interconnections 220 d. Although the interconnections 220 d shown in FIG. 15 avoid the beam shifter 81, the interconnections 220 d may intersect the beam shifter 81, that is, the interconnections 220 d may run beneath the beam shifter 81. Because signals are carried on the interconnections 220 d substantially in the DC mode, the quality of those signals is not affected by an environment of the wiring.

Output Unit

FIG. 16 is a plan view of the output unit 230. The output unit 230 includes the output lens system 73 comprising two first lenses 73 a and two second lenses 73 b. The output lens system 73 converts two modulated beams, M2 b and M2 c, output from the optical modulator 20 into collimated beams, multiplexes the collimated two beams, and outputs the multiplexed beam to the first output port 3 a as the output beam D1. The output unit 230 further includes a skew adjuster 74, two optical isolators, 75 a and 75 b, a polarization beam combiner (PBC) unit 76, and a variable optical attenuator (VOA) 77. The skew adjuster 74 may compensate a difference of optical paths from the optical modulator 20 to the PBC unit 76 for the respective modulated beams, M2 b and M2 c. The PBC unit 76 includes a reflector 76 a and a PBC element each made of multi-layered optical films.

One of the output lens systems 73 collimates the modulated beam M2 c toward the first output port 3 a, while, the other of the output lens systems 73 also collimates the other modulated beam M2 b toward the mirror 76 a in the PBC unit 76. The output lens systems 73 each include the first lens 73 a set closer to the optical modulator 20 and the second lens 73 b set closer to the PBC unit 76. The two modulated beams, M2 b and M2 c, are each collimated by the respective lens system 73.

One of the modulated beams M2 c is collimated by the output lens system 73 and enters the PBC unit 76 as passing through the skew adjuster 74 and the optical isolator 75 b. The other modulated beam M2 b is also collimated by the output lens system 73 and enters the PBC unit 76 as passing through the optical isolator 75 a. The skew adjuster 74 may compensate the optical path difference of the two modulated beams, M2 b and M2 c. That is, the modulated beam M2 b comes the PBC element 76 b running on an extra path from the mirror 76 a to the PBC element 76 b compared with the other modulator beam M2 c that directly comes straight to the PBC element 76 b from the optical modulator 20. The skew adjuster 74, by being set intermediate of the optical path for the modulated beam M2 c, may compensate the optical length of this extra path. The skew adjuster 74 of the embodiment may be a block made of material transparent for the first CW beam, silicon (Si) in the present embodiment, and set slightly inclined with respect to the optical axis of the modulated beam M2 c to prevent the optical beam reflected thereby from coming back to the optical modulator 20.

The modulated beams, M2 b and M2 c, inherently have the polarization reflecting that of the first CW beam entering the optical modulator L1, because the optical modulator 20 includes no components to rotate the polarization of the incident beam. Accordingly, two modulated beams, M2 b and M2 c, have the polarization identical to each other. Two optical isolators, 75 a and 75 b, may rotate the polarization of the incident beams, M2 b and M2 c, independently, that is, the optical isolators, 75 a and 75 b, may set a difference of 90° in the polarization between two outgoing beams. For instance, setting a half-wave plate (λ/2-plate), which may rotate the polarization of incident beam by 90°, only in one of the optical isolates, two modulated beams, M2 b and M2 c, output from the optical isolators, 75 a and 75 b, may show the polarization status different by 90° to each other. The modulated beams, M2 b and M2 c, enter the PBC element 76 b as maintaining the polarization status thereof.

The PBC element 76 b includes multi-layered optical films and shows a peculiar property depending on the polarization of the incoming beam. For instance, the PBC element 76 b may show large reflectance, equivalently small transmittance, for the incident beam having the polarization within the incident plane while large transmittance, equivalently small reflectance, for the incident beam with the polarization perpendicular to the incident plane, where the incident plane may be formed by the optical axis of the incident beam and the normal of the incident surface of the PBC element 76 b. Setting the polarization direction of the modulated beam M2 c in perpendicular to the incident plane for the PBC element 76 b, but that of the other modulated beam M2 b in parallel to the incident plane, the former modulated beam M2 c in almost all portion thereof may transmit the PBC element 76 b, and the latter modulated beam M2 b in almost all portion thereof may be reflected by the PBC element 76 b. Thus, the two modulated beams, M2 b and M2 c, may be effectively multiplexed, e.g., polarization-multiplexed, by the PBC element 76 b by rotating the polarization of one of the modulated beam M2 b by 90° by the optical isolator 75 a. The PBC unit 76 outputs thus multiplexed beam to the VOA 77.

The two optical isolators, 75 a and 75 b, are the type of polarization dependent isolator. By setting a magnet, not shown in figures, for inducing magnetic fields commonly to the isolators, 75 a and 75 b, the embodiment is implemented with the integrated optical isolator 75. Moreover, the description above concentrates on an arrangement where only the optical isolator 75 a provides the λ/2-plate in the output thereof. However, an alternative may be applicable where one of the optical isolators 75 a sets the crystallographic axis thereof in −22.5° but the other isolator 75 b sets the crystallographic axis in 22.5° with respect to the polarization direction of the modulated beams, M2 b and M2 c. Then, the modulated beams, M2 b and M2 c, output from respective optical isolators, 75 a and 75 b, have the respective polarization directions thereof perpendicular to each other.

Thus, the arrangement, where two first lenses 73 a and two second lenses 73 b, the skew adjuster 74, the optical isolator 75, and the PBC unit 76, are mounted on the base 200 a via the carrier 230 a made of AlN, which will be referred as the fourth carrier, may simplify the optical alignment for those components with respect to the modulated beams, M2 b and M2 c, output from the optical modulator 20. Because those optical components on the carrier 230 a inherently have dull temperature characteristics, it is unnecessary to control temperatures of those components by the second TEC 21 in the modulator unit 200. Accordingly, the area 200C of the base 200 a, where the carrier 230 a is mounted, is overhung from the area 200A overlapping with the top plate 21 a of the TEC 20 and leaves a wide space under the carrier 230 a. The optical module 1 of the present invention installs two wiring substrates, 90 a and 90 b, to carry signals from the DC terminals 5 b in the side wall 2D of the housing 2 to the laser unit 100 installed in the side of the other side wall 2C.

The reason to set the VOA 77 downstream the PBC unit is, when the optical module 1 is installed within an optical transceiver having functions to transmit an optical signal and to receiver another optical signal concurrently, a situation is probably encountered where only the function of the signal transmission is killed as leaving the function of the signal reception. In such a case, only the second output D2 of the optical module 1 is required. When the biases supplied to the t-LD 10 is cut to stop the operation thereof, the second output D2 also disappears. The VOA 77 set in the path for the first optical output D1 may interrupt the operation only of the signal transmission.

When a VOA is set in upstream of the optical modulator 20, the function to stop the signal transmission may be realized. However, this arrangement fully suspends the input of the first CW beam L1 to the optical modulator 20. The optical modulator 20 is necessary to adjust the biases supplied to the offset electrodes and the quadrature electrodes using the first CW beam L1 to adjust the phases of two optical outputs, M2 b and M2 c. Such adjustments may be carried out for the modulated signals, M2 a and M2 d, output from the monitor ports, 25 a and 25 b, even when the modulated beams, M2 b and M2 c, are suspended.

The optical module 1 sets the m-PD 79 a in downstream of the VOA 77. The m-PD 79 a, which is mounted in a side of the PD sub-mount 79A, senses a portion of the optical output D1 split by the BS 78. The m-PD 79 a, the PD sub-mount 79A, and the BS 78 are mounted on the VOA carrier 77A, which is placed on the bottom of the housing 2 independent of the carrier 230 a. The output of the m-PD 79 a is used for detecting the degradation of elements integrated within the optical modulator 20 and the excessive output power of the optical module 1.

As shown in FIG. 16, the output unit 230 is also implemented with the two-lens system 73 for respective modulated beams, M2 b and M2 c. The field pattern of the modulated beams, M2 b and M2 c, is usually deviated from a true round reflecting the cross section of the waveguide in the optical modulator 20. Such a distorted beam usually degrades the coupling efficiency against an optical fiber with a circular field pattern. The two-lens system of the present optical module 1 may suppress the reduction of the coupling efficiency between the optical beam with a distorted filed pattern and an optical medium with a circular cross section. In an alternative, the optical module 1 may set a beam shaper downstream the PBC unit 76 to modify the field pattern of the output beam D1.

FIG. 17 shows a cross section of the optical module 1, which is taken along the optical axes of the first CW beam L1 and the second CW beam L2. Referring to FIG. 17, the carrier 220 a of the joint unit 220 does not interfere with the optical axis of the first CW beam L1 coming from the t-LD 10 to the BS 61. Referring to FIG. 15, the joint unit 220 provides the interconnections 220 d that carries the biases from the DC terminals 5 a in the side wall 2C to the pads 46 a on the optical modulator 20 connected to the offset electrodes, 51 j to 52 k, and the quadrature electrodes, 51 c and 52 c. When the pads 46 a are directly wire-bonded to the DC terminals 5 c, not only the bonding wires lengthen but sometimes interrupt the optical axis of the first CW beam L1. The optical module 1 of the embodiment avoids the optical axis by the interconnections 220 d on the joint unit 220 a. That is, the pads 46 a on the optical modulator 20 are first wired to the ends of the interconnections 220 d, and further wired in the other ends thereof to the DC terminals 5 a. Thus, the optical axis of the first CW beam L1 does not interfere with members except for the beam shifter 81 and the optical isolator 82.

Also, the carrier 210 a of the input unit 210 mounts the m-PD 64 a via the PD sub-mount 64A. The m-PD 64 a optically couples with the monitor port 25 a. The biases supplied to the offset electrodes, 51 j to 52 k, and the quadrature electrodes, 51 c and 52 c may be determined based on the output of the m-PD 64 a. The interconnections 63 c on the carrier 210 a that carries the output of the m-PD 64 a to the DC terminal 5 a also does not interfere with the optical axis of the first CW beam L1.

The area A3 of the base 200 a mounts the terminator unit 84 a in addition to the bias unit 86 a. The terminator unit 84 a provides four terminators 85 b and two capacitors 85 d. The terminators 85 b terminate the interconnections, 41 and 42, carrying the modulation signals to the MZ elements, 51M and 52M. The modulation signals provided to the respective MZ elements, 51M to 54M, have magnitudes of about 1 Vp-p. The terminators 85 b with impedance of 50Ω for such modulation signals each consume the power of 20 mW. Accordingly, the optical modulator 20 of the embodiment sets the terminators externally to suppress the power consumption thereof. However, bonding wires from the optical modulator 20 to the terminators 85 b are necessary to be short as possible, the terminator units, 84 a and 84 b, are set immediate to the optical modulator 20.

The area B1 of the base 200 a mounts the other m-PD 64 b via the PD sub-mount 64B for the MZ elements, 53M and 54M, and the area B2 mounts the other terminator unit 84 b and the other bias unit 86 b, where the arrangements of those units, 84 b and 86 b, are same with those aforementioned units, 84 a and 86 a.

As described, the optical modulator 20 is mounted on the base 200 a, and the base 200 a is mounted on the top plate 21 a of the second TEC 21. An optical modulator like the present embodiment inherently shows dull temperature dependence of characteristics thereof. However, the optical coupling between the optical modulator 20, the input unit 210, the joint unit 220, and the output unit 230 may be varied depending on the temperature, which is generally called as the tracking error. Accordingly, the present optical module 1 mounts those units, 210, 220, and 230, commonly on the base 200 a, and the base 200 a is set on the second TEC 21 to suppress the tracking error. However, the temperature dependence of the optical coupling of those units, 210, 220, and 230, are far smaller than that of the t-LD 10. Accordingly, the base 200 a of the present embodiment mounts those units, 210, 220, and 230 on the areas, 200B and 200C, not overlapping with the TEC 21.

FIG. 18 schematically shows a cross section of the optical module 1 taken along the optical axis of the first output port 3 a. The output unit 230 is mounted on the area A3 of the base 200 a projecting from the second TEC 21 via the carrier 230 a, which forms a space under the output unit 230. The optical module 1 installs two wiring substrates, 90 a and 90 b, in this space to supply the biases from the DC terminals 5B in the side wall 2D to the t-LD 10.

FIGS. 19 and 20 are plan views of the arrangement around the wiring substrates, 90 a and 90 b, and FIG. 21 is a perspective view of the wiring between the wiring substrates, 90 a and 90 b, and the laser unit 100. As already described, the t-LD 10 of the present embodiment is necessary to be biased in the electrodes, 14 a to 14 e, to inject carriers into two SOAs, 10 a and 10 d; in the heaters, 15 a and 15 b, in the SG-DFB 10 b, and the heaters, 17 a to 17 c, in the CSG-DBR 10 c; in two heater grounds; and in the signal ground, where total of ten (10) electrodes are necessary to be supplied with respective biases. In a case where these electrodes are biased from the DC terminals 5 a arranged in the side wall 2C closer to the laser unit 100 compared with the other side wall 2D, the DC terminals 5 a in the number thereof occasionally becomes insufficient when the detector unit 300 and the modulator unit 200 are also biased from the DC terminals 5 a. On the other hand, the other side wall 2D along the modulator unit 200 leaves spares of the DC terminals 5 b not connected to anywhere. Accordingly, the optical module 1 supplies the biases to the t-LD 10 from the DC terminals 5 b in the side wall 2D via the wiring substrates, 90 a and 90 b.

As shown in FIGS. 20 and 21, the LD carrier 100A mounts the t-LD 10 and the thermistor 11 f thereon. Two wires W1 extracted from the thermistor 11 f are connected to the DC terminals 5 a in the closer side wall 2C. The other wires W2 are extracted to the DC terminals 5 b in the other side wall 2D through the wiring substrates, 90 a and 90 b. The wiring substrate 90 a closer to the second TEC 21 has a thickness greater than that of the other wiring substrate 90 b because of a room to wire the respective substrates, 90 a and 90 b. That is, the wiring for the wiring substrate 90 a is necessary to be done in a space between the base 200 a and the first TEC 11. On the other hand, the wiring to the other substrate 90 b may be done in a space between the carrier 300 a of the detector unit 300 and the lens carrier 100B, which is relatively wider than the former space. Thus, a space relatively wider is left for the wiring to the wiring substrate 90 b.

The carrier 300 a of the detector unit 300 and the lens carrier 110B on the base 100 a of the laser unit 100, where they sandwich the wiring substrate 90 b therebetween, have relatively thinner thicknesses to mount the BSs, 32 a and 32 b, and the collimating lens 110 b thereon. On the other hand, the other wiring substrate 90 a which locates next to the LD carrier 100A with a thickens thereof greater than a thickness of the lens carrier 110B to align the level of the optical axis of the t-LD 10 and that of the collimating lens 110 b with each other, which means that the top of the t-LD 10 is higher than the top of the lens carrier 110B and that the wiring substrate 90 a is necessary to have a thickness thereof to reduce the difference in the top level between the t-LD 10 and that of the wiring substrate 90 a.

Second Embodiment

FIG. 22 shows a flow chart of a process of assembling the optical module of the first embodiment. Next, the process of assembling the optical module 1 will be described.

S1: Assembling of Laser Unit

The process first assembles the laser unit 100 independent of the optical module 1. The t-LD 10 and the thermistor 11 f are mounted on metal patterns on the LD carrier 100A by a conventional die-mount process using eutectic solder of gold tin (AuSn). FIG. 23 is a perspective view of the t-LD 10 mounted on the LD carrier 100A. The t-LD 10 is mounted on a metal pattern provided on the top of the LD carrier 100A and wire-bonded from electrodes corresponding to the metal patterns 100 b. After the wire-boding, the t-LD 10 may be tested in the DC mode, such as the I-L characteristic of the t-LD 10, and so on, by probing the metal patterns 100 b. When the DC test finds any failures in a t-LD 10; such t-LD 10 is extracted from the subsequent production.

S2: Assembling Modulator Unit

FIG. 24 is a perspective view of the modulator unit 200. The process of assembling the modulator unit 200 is also carried out independent of the assembly of the optical module 1. Specifically, the optical modulator 20 is mounted in a center area 200A of the base 200 a as shown in FIG. 9 via the modulator carrier 20 a; then, the terminator unit 84 a and the bias unit 86 a, and the terminator unit 84 b and the bias unit 86 b are mounted in the areas, A3 and B2, of the sides of the optical modulator 20 on the base 200 a, respectively. These areas, A3 and B2 put the optical modulator 20 therebetween. The terminator units, 84 a and 84 b, solder two chip capacitors 85 d in advance to be mounted on the base 200 a. The terminators 85 b, which are the type of thin film resistor, are formed concurrently with the formation of the interconnections 85 h on the terminator units, 84 a and 84 b. Although the optical module 1 of the embodiment uses the chip capacitors 85 d, the optical module 1 may mount the die-capacitors on the terminator units, 84 a and 84 b. For the bias units, 86 a and 86 b, the die-capacitors 87 a are soldered on the bias units, 86 a and 86 b, in advance to be mounted on the base 200 a. The terminator unit 84 a and the bias unit 86 a, and the terminator unit 84 b and the bias unit 86 b are mounted on the base 200 a via the carriers, 88A and 88B, respectively, where these carriers, 88A and 88B have thicknesses such that the terminator units, 84 a and 84 b, and the bias unit, 86 a and 86 b, in respective top levels become substantially comparable with the top level of the optical modulator 20.

In the process S2 above, the carrier 20 a is first soldered with the base 200 a by a eutectic solder, and the optical modulator 20 is next soldered on the carrier 20 a also by a eutectic solder. Subsequently, the carrier 210 a for the input unit 210, which may be referred as the second carrier, the carrier 220 a for the joint unit 220, which may be referred as the third carrier, the carries, 88A and 88B, commonly for the terminator units, 84 a and 84 b, and the bias units, 86 a and 86 b, the carrier 66A for mounting the m-PD 64 b via the PD sub-mount 64B are also soldered in respective areas on the base 200 a. The carrier 66A mounts a thermistor 66 thereon. Accordingly, the carrier 66A may be called as the thermistor carrier. At the process for soldering the input carrier 210 a on the base 200 a, a rough alignment of the carrier 210 a is carried out.

Specifically, referring to FIG. 25, the carrier 210 a includes a side 210 b, which faces the side 220 c of the joint unit 220, with marks, 210 e to 210 g, linearly extending inward from the edge of the carrier 210 a. The center mark 210 f substantially aligns with the optical axis of the first CW light L1 coming from the laser unit 100 to the BS 61. The side marks, 210 e and 210 g, have distances equal to each other. Aligning the marks, 210 e to 210 g, with the marks, 220 e to 220 g, on the carrier 220 a of the joint unit 220, the input unit 210 may be roughly aligned with the joint unit 220 only by the visual inspection.

The optical modulator 20 also provides marks, 20 c and 20 d, along the edge 20 b facing the input unit 210. The former mark 20 c corresponds to the input port 24, while, the latter mark 20 d indicates the monitor port 25 a. These marks, 20 c and 20 d, have a shape of an isosceles divided into two part by a line evenly dividing a corner constituting the isosceles sides. However, the shapes of those marks, 210 e to 210 g, 220 e to 220 g, and 20 c to 20 d, are optional.

Using those alignment marks, the rough alignment of the input port 24 of the optical modulator 20 with the carrier 210 a, and that between the carrier 210 a of the input unit 210 and the carrier 220 a of the joint unit 220 may be carried out only by the visual inspection. For the alignment of the m-PD 64 a with the monitor port 25 a, because of a large sensitive surface of the m-PD 64 a, only the rough alignment by the visual inspection may achieve an optical coupling efficiency between the m-PD 64 a and the monitor port 25 a with practically acceptable level.

Referring to FIG. 26, the carrier 230 a of the output unit 230, which may be referred as the fourth carrier, provides in a side 230 d facing the optical modulator 20 two marks, 230 b and 230 c. Similarly, the optical modulator 20 provides two marks, 20 e and 20 f, in a side facing the output unit 230. The mark 230 b in the carrier 230 a aligns with the mark 20 b of the optical modulator 20 and also with the optical axis of the modulated beam M2 b. The mark 230 c aligns with the mark 20 e and corresponds to the optical axis of the modulated light M2 c.

The carrier 230 a also provides three marks, 230 e to 230 g, in a side 230 h facing the VOA carrier 77A. The BS carrier 78A also provides three marks, 78 e to 78 g, in a side 78 a facing the carrier 230 a. These marks, 78 e to 78 g, in the BS carrier 78A align with the marks, 230 e to 230 g, in the carrier 230 a of the output unit 230. The two modulated beams, M2 b and M2 c, output from the optical modulator 20 are multiplexed as passing through the BS 78. Thus, the rough alignment of the carrier 230 a with the optical modulator 20 and the BS carrier 78 a with the carrier 230 a of the output unit 230 may be easily performed only by the visual inspection of those marks.

The process of assembling the optical module 1 of the present embodiment omits fine alignments for the BS 78 and the m-PD 79 a to be mounted on the BS carrier 78A. Only the visual inspection of those marks, 78 e to 78 g, and 230 e to 230 g, for the BS 78 and the m-PD 29 a may align the output unit 230 with the optical modulator 20 and the BS.

After mounting those carriers, 210 a, 220 a, and 230 a on the base 200 a, the pads on the optical modulator 20 are wire-bonded to the interconnections on respective carriers. Specifically, the pads, 45 a and 45 b, on the optical modulator 20 are wire-bonded to the terminators 85 b on the terminator units, 84 a and 84 b; the interconnections 85 h on the terminator units, 84 a and 84 b, are wire-bonded to the interconnections on the carrier 220 a of the joint unit 220; the pads, 46 a and 46 b, on the optical modulator 20 are also wire-bonded to the die capacitors 87 a on the bias units, 86 a and 86 b; the die capacitors 87 a are wire-bonded to the interconnections 87 b on the bias units, 86 a and 86 b; and the interconnections 87 b on the bias units are wire-bonded to the interconnections 220 d on the carrier 220 a of the joint unit 220.

The embodiment thus described, the terminator unit 84 and the bias unit 86 a are commonly mounted on the carrier 88A, and the terminator unit 84 b and the bias unit 86 b are also commonly mounted on the carrier 88B. However, the carriers, 88A and 88B, may be divided into two parts, one of which mounts the terminator units, 84 a and 84 b, and the other mount the bias units, 86 a and 86 b. Further, the terminator unit 84 a and the bias unit 86 a disposed in the side of the side wall 2C of the housing may have a substrate common to those units, 84 a and 86 a. Similarly, the terminator unit 84 b and the bias unit 86 b arranged along the side wall 2D may have a substrate common to each units, 84 b and 86 b. Because the bias units, 86 a and 86 b, and the terminator units, 84 a and 84 b, in portions outside of the terminators 85 b process DC signals; respective common substrates do not degrade or affect the operation of the optical modulator 20, rather, the assembly of the bias units and the terminator units may be simplified.

Assembling Detector Unit

The process mounts the thermistor 31 f, two m-PDs, 34 a and 34 b, as interposing respective PD sub-mounts, 34A and 34B, on the carrier 300 a, in the outside of the housing 2. Those components are fixed on respective metal patterns by eutectic solder. As already described, the m-PDs, 34 a and 34 b, have wide optical sensitive areas with diameters thereof greater than several scores of micron-meters; accordingly, the m-PDs, 34 a and 34 b, are unnecessary to be actively aligned with the t-LD 10. The etalon filter 33 is also mounted on the carrier 300 a in this process.

S4: Assembling Optical Module

S4 a: Installing Three TECs

FIG. 27 is a plan view showing a process of installing three TECs, 11 to 31, within the housing 2. The VOA carrier 77A, that mounts the VOA 77 in advance to the installation thereof, and two wiring boards, 90 a and 90 b, are concurrently installed within the housing 2. A conventional technique of the die-bonding is applied to the installation of those devices. As shown in FIG. 27, the bottom plates, 11 b to 21 b, of the respective TECs, 11 to 31, prepare posts in areas exposed from the respective top plates, 11 a to 31 a, to supply the driving currents to the Peltier elements. Those posts are wire-bonded to the DC terminals, 5 a and 5 b, in the respective side walls, 2C and 2D, after the installation of the TECs, 11 to 31.

S4 b: Mounting Laser Unit and Modulator Unit on Respective TECs

The step S4 b mounts the base 100 a of the laser unit 100, which is assembled in the step S1, and the base 200 a of the modulator unit 200, which mounts various units thereon in the step S2, on the respective TECs, 11 and 21.

FIG. 28 is a plan view showing the process which the laser unit 100, the modulator unit 200, and the detector unit 300 are mounted on the respective TECs, 11 to 31, in the housing 2. Optical components required for the active alignment are not implemented therewith. Specifically, the LD carrier 100A that mounts the t-LD 10 by the first eutectic solder in advance to the present step is mounted on the base 100 a of the laser unit 100 by the second eutectic solder whose melting point is lower than that of the first eutectic solder. In the present embodiment, the first eutectic solder is made of SnAgCuBi with a melting point of about 240 C°. Concurrently with the installation of the LD carrier 100A on the base 100 a, two lens carriers, 110A and HOB, are set on the base 100 a. Referring to FIG. 25 again, the LD carrier 100A provides two marks, 112 e and 112 g, and the lens carrier 110A provides marks, 111 e to 111 g. Aligning the marks, 111 e to 111 g, on the lens carrier 110A with the marks, 112 e and 112 g, on the LD carrier 100A only by visual inspection, the lens carrier 110A may be roughly aligned with the LD carrier 100A. Referring to FIG. 29, the other lens carrier 110B may be also mounted on the base 100 a by aligning marks, 114 e to 114 g, on the lens carrier 110B with marks, 113 e to 113 g, on the LD carrier 100A in the side opposite to that appearing in FIG. 25. The two lens carriers, 110A and 110B, are mounted on the base 100 a but the collimating lenses, 110 a and 110 b, are not placed on respective positions on the lens carriers, 110A and 110B. The base 100 a thus mounting the LD carrier 100A and the two lens carriers, 110A and 110B, is to be set on the TEC 11.

The base 200 a of the modulator unit 200, which mounts the various units including the input unit 210 and the joint unit 220, is also fixed on the second TEC 21 by an eutectic solder. Referring to FIG. 25 again, the carrier 220 a of the joint unit 220 provides the marks, 221 e to 221 g, in a side 221 c facing the laser unit 100. On the other hand, the lens carrier 110A of the laser unit 100 also provides marks, 110 e to 110 g, in a side facing the joint unit 220. Aligning these marks, 221 e to 221 g, with the marks, 110 e to 110 g; the modulator unit 200 may be roughly aligned with the laser unit 100. The rough alignment using these marks described above may simplify the fine alignment subsequently carried out for lenses and so on. Positions, where the lenses are to be mounted, provide indices on the respective carriers. However, when the respective carriers are largely misaligned, the fine alignment sometimes becomes unable, because even the components to be finely aligned is set on the indices, substantial optical coupling efficiency could not be obtained. The alignment process inevitably begins a step to find a position at which substantial coupling efficiency is realized.

S4 c: Mounting Detector Unit on TEC

The process next installs the carrier 300 a of the detector unit 300 onto the third TEC 31, where the carrier 300 a assembles the thermistor 31 f, two m-PDs, 34 a and 34 b, and the etalon filter 33 thereon. Referring to FIG. 29, the lens carrier 110B which is assembled on the LD carrier 100A in the aforementioned process provides marks, 115 e to 115 f, in a side opposite to that facing the LD carrier 100A. The carrier 300 a of the detector unit 300 is mounted on the third TEC 31 such that marks, 311 e to 311 f, on the carrier 300 a are visually aligned with the marks, 115 e to 115 g, on the lens carrier 110B. Thus, the detector unit 300 is roughly aligned with the laser unit 100.

S5: Optical Alignment

S5 a: Alignment of Input Unit

The process finally assembles optical components that are required for active alignment. The step S5 a first aligns the input unit 210 of the modulator unit 200 with the laser unit 100 in step S5 a(a). Specifically, the first collimating lens 110 a in the laser unit 100 is necessary to be set in a position where an optical beam output from the first collimating lens 110 a becomes a collimated beam. Referring to FIG. 30, the process first sets a special tool 91 d on a position to which the beam shifter 81 is placed as practically activating the t-LD 10 to emit the dispersive light therefrom. The special tool 91 d, which provides two mirrors fixed in parallel to each other and making an angle of 45° with respect to the optical axis, guides the first CW light L1 output from the t-LD 10 outside of the housing 2 by the parallel translation. Checking the collimation of the first CW light L1 by an optical detector set apart from the housing 2, where the optical detector is set apart about one (1) meter from the optical module in the present embodiment, as sliding the first collimating lens 110 a along the optical axis thereof, the first collimating lens 110 a is fixed in a position where the output beam becomes a collimated beam.

Then, removing the special tool 91 d and setting the beam shifter 81 on the carrier 220 a of the joint unit 220, the process may compensate the offset between the optical axis of the CW light L1 of the laser unit 100 and that of the modulator unit 200. Referring to FIG. 31, the first TEC 11 mounts the t-LD 10 and the collimating lens 110 a thereon, while, the modulator unit 200 mounts the optical modulator 20 on the second TEC 21 through the base 200 a independent of the first TEC 11. Accordingly, the optical axis of the t-LD 10 and that of the optical modulator 20 are usually not aligned in the levels thereof, namely, offset each other. The optical coupling system mounted on the input unit 210, that is, the BS 61 and the two-lens system 63, may compensate this discrepancy of the optical axes. However, it would be hard enough to compensate the discrepancy solely by the BS 61. A rotation angle, an elevation angle, and/or a depression angle are required to align the BS 61. Moreover, it would be physically impossible for the two-lens system to lower them beyond the top of the carrier 210 a. Also, when the lenses, 63 a and 63 b, are set apart from the carrier 210 a beyond a designed distance, the resin that fixes the lenses, 63 a and 63 b, degrades the reliability thereof. Accordingly, the beam shifter 81 of the embodiment compensates the offset in the optical axes between the laser unit 100 and the modulator unit 200. The beam shifter 81 of the present embodiment may be a parallel-piped block made of material transparent to the CW beam L1 and may offset the optical axis of the incident beam by setting the incident surface thereof inclined to the optical axis of the incident beam.

FIG. 31 schematically shows a process of aligning the beam shifter 81 at step S5 a(b). The process measures the level of the first CW light L1 output from the collimating lens 110 a and that of the input port 24 of the optical modulator 20 in advance to a process of assembling the beam shifter 81. The former level may be measured concurrently with the process of forming the collimated beam in the output of the first collimating lens 110 a. From two evaluated values above described, the inclined angle of the beam shifter 81 may be estimated from the following equation: Δd=t×sin θ×(1−cos θ)/√(n ²−sin²θ), where Δd, t, n, and θ are the offset between two optical axes, a thickness of the beam shifter 81, refractive index of the material constituting the beam shifter 81 and an angle to be inclined for the beam shifter 81, respectively. Evaluating the angle θ from the equation above, the beam shifter 81 is passively set so as to make the angle θ with respect to the carrier 210 a without any active alignment.

FIG. 32 schematically shows a process of setting the BS 61 at step S5 a(c). The process first aligns the angle of the BS 61 in 45° against the side wall 2C of the housing 2 using an optical source 91 e, a power monitor 91 m, a 3 dB coupler 91 s, and an auto-collimator 91 a. Specifically, setting the side wall 2C of the housing to be an optical reference plane, the auto-collimator 91 a is set so as to make an angle of 45° with respect to the side wall 2C. During the preparation of the auto-collimator 91 a, the optical beam coming from and reflected to the auto-collimator 91 a passes above the housing 2. Then, the BS 61 is first aligned in the rotation angle thereof in the space outside of the housing 2 such that the optical beam reflected by the back surface of the BS 61 and detected by the power monitor 91 m through the auto-collimator 91 a becomes a maximum. Moving the BS 61 down into the housing 2 as keeping the angle with respect to the side wall 2C, the BS 61 is next adjusted in longitudinal and lateral positions thereof. That is, sliding the BS 61 longitudinally along the optical axis of the beam shifter 81, namely, that of the laser unit 100, and laterally along the optical axis of the input port 24 of the optical modulator 20, a position of the BS 61 is found, at which the monitored beam is detected by the m-PD 64 a and/or the m-PD 64 b through the optical modulator 20. In this step, two lenses, 63 a and 63 b, are uninstalled yet and the m-PDs, 64 a and 64 b, are practically activated. Because the light output from the t-LD 10 is already collimated by the first collimating lens 110 a, the determination of the maximum of the monitored beam, that is, the position of the BS 61, may be accomplished.

Among optical components set between the collimating lens 110 a and the input port 24 of the optical modulator 20, the beam shifter 81, the BS 61, and the two lenses, 63 a and 63 b, may shift the optical axis. The optical alignment in the present embodiment, only the two lenses, 63 a and 63 b, are actively aligned in positions thereof to get the maximum coupling efficiency. Other components, namely, the beam shifter 81 and the BS 61, have functions to roughly align the collimated beam L1 in a position from which the fine alignment for the two lenses, 63 a and 63 b, becomes possible.

The process of aligning the first lens 63 a at step S5 a(d), places the first lens 63 a in a designed position but yet fixed there. Then, as practically activating the t-LD 10 and guiding the optical beam output from the first lens 63 a to the optical modulator 20. Sensing the monitored beam, M2 a or M2 d, by the m-PDs, 64 a or 64 b, the position of the first lens 63 is evaluated at which the sensed monitored beam becomes a maximum. Because no biases are supplied to the optical modulator 20, two m-PDs, 64 a and 64 b, may sense the respective monitored beams, M2 a and M2 d. Subsequent to the evaluation of the desired position, the first lens 63 a is fixed at a position slightly apart from the evaluated position along the optical axis of the input port 24. An ultraviolet curable resin used for the fixation of the first lens 63 a usually shrinks during the curing by several micron-meters, which may misalign the position of the first lens 63 a. The second lens 63 b may compensate this misalignment of the first lens 63 a.

The second lens 63 b may be aligned as sensing the monitored beam, M2 a or M2 d, through the optical modulator 20. Specifically, the second lens 63 b is slid from the center of the designed position along longitudinally, laterally, and vertically as sensing the monitored beam, M2 a or M2 d, and is fixed by also an ultraviolet curable resin at the position at which the sensed monitored beam, M2 a or M2 d, becomes a maximum. Although the ultraviolet resin also shrinks during the curing, which causes deviations from the desirable position determined above, the second lens 63 b has positional tolerance far greater than that of the first lens 63 a. The first lens 63 a has the tolerance only of sub-micron meters, while, the second lens 63 b has the positional tolerance thereof far greater, two or three scores greater than that of the first lens 63 a. Accordingly, the shrink of the ultraviolet curable resin during the curing is substantially negligible for the second lens 63 b. Thus, the optical active alignment of the input unit 210 is completed.

Alignment of Output Unit

The process next assembles the output unit 230 of the modulator unit 200. Because the input unit 210 accompanied with the laser unit 100 and the joint unit 220 is already aligned with the optical modulator 20, the first CW light L1 is practically input to the input port 24 and two output beams, M2 b and M2 d, are output from the output ports, 22 a and 22 b, by adjusting the biases to the offset electrodes, 51 j to 54 j and 51 k to 54 k, and the quadrature electrodes, 51 c to 54 c. Setting the special tool 91 d at a position where the second lens 73 b is to be placed, the first lens 73 a is positioned such that the optical beam output from the first lens 73 a becomes a collimated beam. Then, the first lens 73 a is fixed in a position slightly closer to the optical modulator 20 (step S5 b(a)). Accordingly, the optical beam output from the first lens 73 a becomes a dispersive beam.

In an alternative, the optical modulator 20 is set such that only one of the output ports, for instance, the output port 22 a, generates the modulated beam M2 b by adjusting the biases supplied to the electrodes, 51 j to 54 j, 51 k to 54 k, and 51 c to 54 c. The first lens 73 a is aligned in a position thereof such that, as detecting the optical beam output from the first lens 73 a at a far point through a window set in the first output port 3 a, and an initial position of the first lens 73 a is determined such that the output beam becomes a collimated beam. The first lens 73 a is fixed in a point slightly closer to the optical modulator from the initial position along the optical axis of the first lens 73 a. Because the PBC unit 76 is assembled on the carrier 300 a, the output beam M2 b output from the output port 22 a, which is offset from the optical axis of the first output port 3 a, may be detected through the first output port 3 a as passing through the PBC unit 76. The other first lens 73 a optically coupled with the output port 22 d of the optical modulator 20 may be similarly aligned with the optical modulator 20 and fixed on the carrier 230 a.

The process (S5 b(b)) of aligning the second lens 73 b will be described. The process first sets a dummy port on the first output port 3 a of the housing 2. The dummy port, which emulates the coupling unit 6 practically provided on the output ports, 3 a and 3 b, includes a coupling fiber and a concentrating lens that concentrates an optical beam entering therein onto the coupling fiber. An optical beam coupled to the coupling fiber may be detected from another end of the coupling fiber.

The process first aligns the second lens 73 b to be set for the output beam M2 b output from the port 22 a. Adjusting the biases supplied to the optical modulator 20, the process sets the optical modulator 20 in a status at which only the output beam M2 b is output from the port 22 b by eliminating the other beam M2 c. Sliding the second lens 73 b in a plane in parallel to the carrier 230 a, the initial position of the second lens 73 b is evaluated at which the optical power detected through the coupling fiber in the dummy port becomes a maximum. Subsequently, procedures same as above described are performed for the other second lens 73 b. That is, adjusting the biases supplied to the optical modulator 20, the procedure sets the optical modulator 20 in the status where only the output beam M2 c is output from the port 22 b by eliminating the other output beam M2 b. Then, adjusting the position of the second lens 73 b for the other output beam M2 c and evaluating the position at which the maximum coupling efficiency is obtained for the coupling fiber by detecting the output power through the coupling fiber in the dummy port. Comparing the maximum output power obtained for the output beam M2 b with the maximum output power obtained for the other output beam M2 c, the output beam by which a greater output power is obtained is called as the primary beam, while, the other output beam showing a smaller output power is called as the subsidiary beam. The procedure then adjust the position of the second lens 73 b of the primary beam such that the output detected through the dummy port becomes equal to the output power for the subsidiary beam. The second lens 73 b for the primary beam is fixed thereat. The second lens 73 b for the subsidiary beam is fixed at a position the output power detected through the coupling fiber becomes a maximum. Thus, two beams, i.e., the primary beam and the subsidiary beam, may couple with the dummy port in the same coupling coefficient, which is carried out in step S5 b(b).

When the maximum output power for the subsidiary beam exceeds a designed power, which is primarily defined by the eye-softer for laser light, the second lens for the primary beam is positioned such that the output power detected through the dummy port becomes equal to the designed maximum and the second lens 73 b for the subsidiary beam is also positioned such that the output power detected through the dummy port becomes equal to the designed maximum.

Finally, removing the dummy port from the output port 3 a and setting the coupling unit 6 onto the first output port 3 a, the alignment of the coupling unit 6 may be carried out as follows: that is, releasing the biases supplied to the optical modulator 20, the two beams, M2 b and M2 c, output from the output ports, 22 a and 22 b, couple the coupling unit 6. The coupling unit 6 is aligned such that the output power detected through the coupling fiber in the coupling unit 6 becomes a maximum. The coupling unit has a function to move the coupling fiber in a plane perpendicular to the optical axis thereof and in parallel to the optical axis. Accordingly, moving the coupling fiber relative to the concentrating lens in the coupling unit, the maximum coupling efficiency may be evaluated.

In an alternative, similar to the modified alignment procedures for the second lenses 73 b described above, only one of the output beams, M2 b and M2 c, is coupled with the coupling unit 6 by adjusting the biases supplied to the optical modulator 20, and the position of the coupling fiber relative to the collimating lens in the coupling unit is aligned such that the output power detected through the coupling fiber becomes equal to that obtained in the alignment process for the second lens 73 b. When the coupling unit 6 is once aligned for the one of the output beams, M2 b and M2 c; the other of the output beams, M2 b and M2 c, may be automatically obtained because the second lens 73 b for the other output beam is aligned such that the output power detected through the coupling fiber is equal to the one for the other output beam.

The reason why the second lenses 73 b are independently adjusted in the positions thereof such that the output power detected through the coupling unit 6 becomes equal to each other is that the two output beams, M2 b and M2 c, have respective polarizations perpendicular to each other and each containing transmitting information of 0° and 90° independent to each other. Accordingly, when the output power of the two beams, M2 b and M2 c, show a large difference, the error rate contained within the transmission information drastically increases.

S5 c: Alignment of Detector Unit

Before the alignment of the detector unit 300, the process first aligns the second collimating lens 110 b mounted on the base 100 a of the laser unit 100 through the lens carrier 110B. The procedure first activates the t-LD 10 and sets the special tool 91 d, which is used in the alignment of the other collimating lens 110 a, at a position where the first BS 32 a is to be placed. The tool 91 d carries the second CW light L2 output from the back facet 10B of the t-LD 10 out of the housing 2. Similar to the alignment of the first collimating lens 110 a, as monitoring the second CW light L2 at a point apart from the housing 2, and the process aligns the second collimating lens 110 b in the point where the monitored CW light L2 becomes a collimated beam. Finally, the second collimating lens 110 b is fixed thereat by curing ultraviolet curable resin.

Then, the process aligns two BSs, 32 a and 32 b. First, as monitoring the second CW light L2 by the first m-PD 34 a, the first BS 32 a is slid from a designed position along a direction in parallel to the optical axis of the second CW light L2 output from the second collimating lens 110 b. The first BS 32 a is fixed at the position, slightly apart from a temporal position along the optical axis of the second CW light L2, at which the second CW light L2 monitored by the first m-PD 34 a becomes a maximum. The reason why the first BS 32 a is slightly slid is that the second CW light L2 reflected by the first BS 32 a and entering the second m-PD 34 b is refracted by the second BS 32 b. The m-PD 34 a is set at a position slightly offset from the optical axis of the second CW light L2 because the second CW light L2 passing through the first BS 32 a and the etalon filter 33 is refracted thereby. During the alignment of the first BS 32 above, the process does not rotate the BS 32 because the second CW light L2 is converted into a collimated beam having a relatively large field diameter. The second BS 32 b is aligned as follows: the process first sets a dummy port, which has the same arrangement with that of the aforementioned dummy port utilized in the alignment process for the output unit 230 of the modulator unit 200, on the second output port 3 b of the housing 2. The second BS 32 b is aligned such that the optical beam reflected by the second BS 32 b and detected through the coupling fiber in the dummy port becomes a maximum.

The optical module 1 may replace the BSs, 32 a and 32 b, of the parallel plate type with those of the prism type. A BS of the prism type sticks two optical prisms and has a cubic plane shape. The optical alignment of the BS of the prism type may be accomplished by the same procedures with those above described for the parallel plate type. That is, without performing the rotational alignment of the prism BS, the first and second BSs are aligned as sliding parallel and perpendicular to the optical axis of the second CW light L2 output from the second collimating lens 110 b to find respective positions at which the optical power detected through the dummy port becomes a maximum. A BS with the prism type inherently has a medium split ratio of about 10:90; that is, 10% of the incident beam may transmit the BS, and the rest 90% thereof may be reflected. Accordingly, the optical output power available at the second output port 3 b is reduced to 80% of the optical beam just output from the t-LD 10. On the other hand, a BS with the parallel plate type shows a split ratio of about 5:95, 5% of the incident beam transmits but the rest 95% is reflected. Accordingly, the optical output power available at the second output port 3 b becomes 90% of that of the optical beam just output from the back face 10B of the t-LD 10, which is about 10% greater than that available for the BSs for the prism type. The dummy port set on the second output port 3 b is replaced by the coupling unit having the arrangements same with those of the coupling unit as aligning the coupling unit on the second output port 3 b so as to recover the optical coupling efficiency between the second BS 32 b with the coupling port.

S6: RF Wiring

Finally, the process of assembling the optical module 1 performs the wiring from the RF terminals 4 in the rear wall 2B to the signal pads, 41 to 44, on the optical modulator 20. However, the wiring for the RF pads, 41 to 44, may be carried out concurrently with the wiring for the DC terminals, 5 a and 5 b. Ceiling the housing 2, the process of assembling the optical module 1 is completed.

Modification

The process thus described has an order to assemble respective units, 100 to 300, from the laser unit 100, the input unit 210, the output unit 230, and the detector unit 300. However, the process is not restricted to this order. The alignment of the detector unit 300 may be carried out just after the alignment of the laser unit 100 before the process of aligning the modulator unit 200. Only the limited order is that the alignment of the input unit 210 is necessary to be done before the alignment of the output unit 230, because the latter alignment uses the optical beams, M2 b and M2 c, output from the optical modulator 20, and these beams, M2 b and M2 c, derive from the first CW light provided from the input unit 210.

The optical module 1, as described, installs the laser unit 100, the modulator unit 200, and the detector unit 300 within one housing 2, which results in a complex arrangement within the housing 2. However, an optical coherent transceiver implementing the optical module 1 of the invention may simplify the arrangement thereof. Such a coherent optical transceiver is at least unnecessary to install an optical source independently. Also, the optical alignment process between the units becomes unnecessary when the coherent optical transceiver installs the optical module 1 of the invention.

The optical module 1 thus described provides TECs, 11 to 31, independent for the laser unit 100, the modulator unit 200, and the detector unit 300. Accordingly, the respective units, 100 to 300, may be precisely controlled in temperatures thereof depending on calorific amounts of respective units, 100 to 300. The emission wavelength of the t-LD 10 may be precisely controlled independent of the temperatures of the optical modulator 20 and that of the detector unit 300. The optical modulator 20 may be optionally controlled in the operation thereof. The detector unit 300 may precisely determine the emission wavelength of the t-LD 10.

The optical alignment of the collimating lenses, 110 a and 110 b, utilizes the special tool 91 d that takes the optical beams output from the t-LD 10 out of the housing 2, which enables to determine the positions of the collimating lenses at which the optical beams output from the respective lenses, 110 a and 110 b, become collimated beams. Also, the input unit 210 provides the two-lens system to couple the first CW light L1 with the input port 24 of the optical modulator 20. The two-lens system may compensate the deviation inherently caused during the solidification of the ultraviolet curable resin.

The optical modulator 20 of the embodiment provides the monitor ports, 25 a and 25 b, that output the monitored beams, M2 a and M2 d, respectively, which are split from the output beams, M2 b and M2 c. Accordingly, the monitored beams, M2 a and M2 d, may be served for the active alignment of the optical components in the input unit 210.

In the foregoing detailed description, the method and module of the present invention have been described with reference to specific exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the present invention. The present specification and figures are accordingly to be regarded as illustrative rather than restrictive. 

The invention claimed is:
 1. A process of assembling an optical module that installs a laser unit, a modulator unit, and a detector unit enclosed within a housing, the laser unit including a semiconductor laser diode (LD) having a front facet that outputs a first continuous wave (CW) beam and a rear facet that outputs a second CW beam, the modulator unit that modulates the first CW beam and includes an input unit and an output unit, the detector unit that determines a wavelength of the second CW beam, the housing including a first output port and a second output port, the method comprising steps of: installing a first thermo-electric cooler (TEC), a second TEC, and a third TEC within the housing; mounting the laser unit on the first TEC, the modulator unit on the second TEC, and the detector unit on the third TEC, respectively; optically coupling one of the first CW beam with the first output port of the housing through the modulator unit and the second CW beam with the second output port of the housing through the detector unit; and optically coupling another of the first CW beam with the first output port of the housing through the modulator unit and the second CW beam with the second output port of the housing through the detector unit, wherein the step of coupling the first CW beam with the first output port includes steps of: optically coupling the laser unit with the modulator unit through the input unit; and optically coupling the modulator unit with the first output port through the output unit, and wherein the step of coupling the second CW beam with the second output port includes steps of: optically coupling the detector unit with the laser unit; and optically coupling the detector unit with the second output port.
 2. The method of claim 1, wherein the modulator unit further includes an optical modulator that modulates the first CW beam; the laser unit further includes a first collimating lens optically coupled with the front facet of the LD; and the input unit of the modulator unit includes a beam splitter (BS) and an input lens system having a first lens and a second lens disposed apart from the optical modulator relative to the first lens, the BS reflecting the first CW beam that passes through the first collimating lens toward the optical modulator, wherein the step of coupling the laser unit with the modulator unit includes steps of: disposing the first collimating lens at a position where the first CW beam passing through the first collimating lens becomes a collimated beam; coupling the first CW beam output from the first collimating lens with the optical modulator by reflecting the first CW beam as sliding the BS along an optical axis of the first CW beam; coupling the first CW beam reflected by the BS with the optical modulator by the first lens of the input lens system; and compensating for an optical coupling loss between the first lens of the input lens system and the optical modulator by sliding the second lens of the input lens system along an optical axis of the first lens of the input lens system.
 3. The method of claim 2, wherein the step of sliding the BS, the step of coupling the first CW beam with the optical modulator by the first lens, and the step of compensating for the optical coupling loss each includes a step of monitoring the first CW beam coupled with the optical modulator and output therefrom.
 4. The method of claim 2, wherein the input unit of the modulator unit further provides a joint unit including a beam shifter, wherein the step of coupling the laser unit with the modulator unit further includes a step of, after the step of disposing the first collimating lens but before the step of sliding the BS, offsetting the first CW beam that passes through the first collimating lens by the beam shifter so as to compensate a level difference between the optical axis of the CW beam at the first collimating lens and an optical axis of the optical modulator.
 5. The method of claim 2, wherein the optical modulator forms a pair of first CW beams from the first CW beam, and provides two output ports, and the output unit includes two output lens systems corresponding to the output ports of the optical modulator, the output lens systems collimating the pair of first CW beams output from the respective output ports of the optical modulator, the output lens systems including first lenses and second lenses that are disposed apart from the optical modulator with respect to the respective first lenses, and wherein the step of coupling the modulator unit with the first output port of the housing includes steps of: disposing the first lenses of the output lens systems in respective initial positions at which the pair of first CW beams output from the respective output ports of the optical modulator and passing through the respective first lenses of the output lens systems become collimated beams; shifting the first lenses of the output lens systems from the respective initial positions by a preset distance; compensating for optical coupling losses between the respective first lenses of the output lens systems and the first output port by the respective second lenses of the output lens systems; and equalizing the optical coupling losses by aligning one of the second lenses of the output lens systems that causes the smaller optical coupling loss against the first output port.
 6. The method of claim 1, wherein the laser unit further includes a second collimating lens, and the detector unit includes a first BS and a second BS, wherein the step of coupling the detector unit with the laser unit includes a step of disposing the second collimating lens at a position at which the second CW beam passing through the second collimating lens becomes a collimated beam, and wherein the step of coupling the detector unit with the second output port includes steps of: reflecting, by the first BS, the second CW beam passing through the second collimating lens toward a direction perpendicular to a direction of an optical axis of the second CW beam passing through the second collimating lens; and reflecting, by the second BS, the second CW beam reflected by the first BS toward the second output port.
 7. The method of claim 6, wherein the detector unit further includes a monitor photo diode (mPD), wherein the step of reflecting the second CW beam by the first BS includes a step of detecting, by the mPD, the second CW beam reflected by the first BS as sliding the first BS along the optical axis of the second CW beam entering the first BS, and wherein the step of reflecting the second CW beam by the second BS includes a step of sliding the second BS along a direction perpendicular to the optical axis of the second CW beam entering the first BS.
 8. The method of claim 6, wherein the steps of disposing the first collimating lens and the step of disposing the second collimating lens include a step of guiding the first CW beam output from the first collimating lens outside of the housing, and the second CW beam output from the second collimating lens outside of the housing, respectively. 